Manual wire bonder ultrasonically wires devices to packages with 0. Find the latest kulicke and soffa industries, i klic stock quote, history, news and other vital information to help you with your stock trading and investing. When an automatic wire bonder attempts to bond a fine wire to a lead out pad and there is no fine wire, or no ball under the working face of the bonding tool, the bonding tool makes direct contact with the lead out pad and can easily destroy the pad and the very expensive vlsi device on the attempt to make the next wire bond interconnection. Choosing bond or wedge bonding for ballbonding push the white teflon spool on the bonder head connected to the drag arm all the way left. A motorized y axis with autostepback provides controlled wire length and repeatable loop formation. These are amazing machines that attach very small wires to the chips, make a very low loop, and connect them to the leads in a package. Kulicke and soffa the little semiconductor engine that could. Equipmatching is a marketplace for used, surplus and refurbished equipment, machinery and spare parts. The 4523 offers control of individual bond parameters, loop height and force, along with the capability of using a wide range of wire dia. A comprehensive portfolio of flexible service, field kitsupgrades, machine and subassembly.
This is being sold as pictured we do not have further information on this unit unit powers on but has not been tested further. Kulicke and soffa 4500 manual bonder cornell center for. Kulicke and soffa model 4526 wire bonder users manual. Investors have failed to realize value in this company. Offering operator control over looping and wire length, the bonder provides excellent results in tight spaces or for unusual loop requirements. The main wire clamp, firmly holds the wire when needed and releases when feeding wire. Kulicke and soffa model 4526 wire bonder users manual coral name. A pickup truck or van will necessary for transport. Advanced ultralowloop wire bonds bob chylak, lee levine, stephen babinetz, o.
The wire tension clamp and solenoid, the clamp loosens to freely feed wire between bond phases with a set tension that straightens the wire as it is fed. It provides digital controls with semiautomatic bonding cycle, but manual alignment. The 4700 features analog dials for ease of use, combining the best features of the workhorse 4523 and 4524 models. Manual wire bonders by mpp with over 30 years of wire bonding experience the current range of mpp wire bonders include the i5000b ball bonder, i5000w wedge bonder and i5000d dual bonder, which has both ball bonding and deep access wedge bonding capabilities. Wedge wire and ribbon bonder for contacting devices. The 8090s rotary bondhead attaches up to 5 wedge bonds per second. Kulicke and soffa model 4123 universal wire bonder giga.
All removals must go through jim roy of freightsaver ph 657 2260909, email. Please call 8566974400 or write jmc for more information. The system can be configured for wires as small as 8 microns. Otherwise this item will require a handling charge, plus the cost of shipping. We have experienced customer service representatives standing by ready to help you. Klic is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing, and industrial segments. The 4500 series bonders have common operation principles and bonding methods. This category includes any equipment that is used in a laboratory environment for purposes such as testing and analysis. Pdf footprint study of ultrasonic wedgebonding with aluminum.
It is versatile enough to bond simple discrete devices up to complex hybrid, microwave and deep cavity devices. Introduction the purpose of the gold ball wire bonder is to provide conductive leads from an integrated circuit chip or any other device needing connectivity so that power can be applied to and signals can be received from the finished devices. Model 4524 ball bonder for gold wire offers versatile production capabilities for bonding applications from simple discrete devices up to complex hybrid, microwave devices. In addition, the system has a large working area and table motion, with. A digital interface manages up to 200 programs and allows quick adjustment of machine settings and for programs to be stored or recalled instantly. The kulicke and soffa wire bonder uses heat and ultrasonic thermosonic energy to stitch connecting wires between suitable bond points on semiconductor circuits or between bond points and external contacts such as package leads. This only includes the system shown in the pictures. The wire bonder makes such low loops by whipping the wire around like a cowboy doing rope tricks. Powerc wedge bonder is built specifically for singlerow to package power devices. These bonders are driven by proven and powerful directdrive motion. This equipment may include centrifuges, glove boxes, fume hoods, sterilizers, and similar equipment.
Atalar april 2017 4700ad model wire bonder can act like a wedge or ballbonder. When i removed the main cover everything appears to be in fairly good condition under there as well. Salary reductions will apply companywide, with the exception of the companys wedge bonder business unit, which is expected to implement a similar level of cost reductions in the next several weeks. Kulicke and soffa industries, i klic stock price, quote. The company anticipates it will take additional actions in fiscal 2009 to further reduce cash expenditures if business conditions remain weak. The bonder can be operated in auto cycle or manual mode. This is the latest addition to the highly successful power series product line, which offers. With over 35 years worth of industry experience and a proven background in microelectronic assembly, we have earned the reputation as one of the premier names in semiconductor. The nanofab has two wire bonders, one dedicated to gold wire bonding and the other dedicated to aluminum wire bonding. The kulicke and soffa model 4526 wedge wire bonder provides electrical interconnects between a device chip and package using thin aluminum or gold wires. Includes leica mz6 stereozoom with 10x21 eyepieces and ergotilt head, spot illuminator and flexlamp, right handed chessman. Typically the device is mounted on or in a standard. Factors such as dust, humidity, temperature, and frequent movement. Wedge bonder offers versatile production capabilities designed for aluminum wire, gold wire and ribbon, the model 4523 manual wedge bonder offers the versatility to bond simple discrete devices up to complex hybrid, microwave devices.
Advanced ultralowloop wire bonds bob chylak, lee levine. A bonding head with a deep access option and tail adjust system supports deep cavity microwave. Kulick and soffa 4123 gold or aluminum wire wedge bonder no temperature controller. In the user manual refer to 4523ad for wedge bonding and 4524ad for ballbonding.
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